In regards to Ultra-fast signal processing and data communication, the demanded qualities are becoming extremely high in fields of finance, medicine, science technology, transportation and defense, thus various equipments are being developed for constructing relevant dedicated computers and communication networks.

DEO Corp. provides various IC (SoC, NPU, GPU, AP, Hybrid IC, PIC), and active passive components (analog, digital, mixed signal) and interconnects solutions that connects these.

Since early 90s, over 30+ Years, DEO has been the reliable technical advisor 
based on deep understanding on SI, PI, EMI and ESD problems
of high speed computing, imaging and networking systems.

[PROVIDING PRODUCTS]

• Optical Transceiver & Interconnects
• High Speed Digital, Mixed Signal IC (Analog, Digital, RF/MW, Power and Optic)
• Hybrid 3D Chipset and Interconnection Technology (On-chip Interconnect, Package, Socket & Interposer, Probe head)

[APPLYING SYSTEMS]

• C4ISR Systems
• Electronic Warfare Systems (Electronic Attack, Protect and Sensing)
• High-throughput communication satellites (HTCS)
• Military SAR Satellite
• Space-Based Communications
• USA (Unmanned Aerial System) & UAV (Unmanned Aerial Vehicle)
• Avionics & Aircraft Modernization
• In-flight entertainment systems & connectivity (IFEC)
• Extended Reality Technology (VR AR XR)
• Smart / Autonomous Car
• Industrial automation & Machine Vision
• Surveillance cameras for Smart City, Factory